Temperature shock tests are conducted to determine if the hardware can withstand sudden changes in the temperature of the surrounding atmosphere without experiencing physical damage or deterioration in performance.
As a result of exposure to sudden temperature changes, operation of the test item may be affected either temporarily or permanently. Examples of problems that could occur as a result of exposure to sudden changes in temperature are:
- Shattering of glass
- Binding or slackening of moving parts
- Separation of constituents
- Stiffening of shock mounts
- Changes in electronic components
- Electronic or mechanical failures due to rapid water or frost formation
- Differential contraction or expansion of dissimilar hardware
- Deformation or fracture of components
- Cracking of surface coatings
- Leaking of sealed compartments
Trimble Kenai®, Yuma® 2, Nomad® 1050, Juno® T41 and Ranger™ 3 passed the following test:
- Procedure I: temperature shock tested using two thermal chambers set at -30 °C and 60 °C (-22 °F and +144 °F), with a four-hour minimum soak and a five-minute maximum transfer time between chambers. A total of four cycles are conducted through both chambers.